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Yes, we support hot-pressed, sintered, and reaction-bonded grades depending on mechanical and thermal needs.
Yes. Si₃N₄ can achieve fine surface finishes using advanced lapping and polishing techniques.
Yes. Its hardness requires diamond grinding and specialized CNC methods to prevent cracking and achieve precision.
It is commonly used for high-stress, high-speed, and high-temperature components, especially in aerospace and mechanical systems.
Yes, except when exposed to hydrofluoric acid (HF), which etches silicon and silicon oxide.
Yes. Mirror finishes with sub-nanometer roughness are achievable using CMP or diamond slurry techniques.
Yes. It is brittle and requires specialized diamond tooling and stress-free processing.
Silicon is machined into substrates, microchannel plates, and high-purity components for electronics and optics.
Yes. It resists almost all acids, bases, and solvents—except hydrofluoric and hot phosphoric acid.
Yes. Sapphire can be polished to achieve ultra-flat, sub-nanometer surface finishes for optical-grade use.
Yes. It’s one of the hardest materials in use and requires diamond grinding and high-precision techniques.
Sapphire is machined into windows, lenses, and structural components where mechanical durability, optical transmission, and chemical stability are required.
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