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Yes. Every project is reviewed by our engineering team for manufacturability, tolerances, material selection, surface finishes, and inspection requirements before production.
Yes. Tungsten’s low vapor pressure and thermal stability make it well-suited for high-vacuum and semiconductor processing applications.
Yes. Tungsten is extremely hard and brittle at room temperature, making it challenging to machine. Specialized tooling, conservative cutting strategies, and stress-controlled processes are required to prevent cracking or chipping.
Pure Tungsten is used in extreme-temperature and high-density applications such as aerospace counterweights, semiconductor ion implantation components, and high-temperature furnace hardware.
Kovar is machinable but prone to work hardening. Proper cutting parameters and stress-aware machining sequences are essential to maintain dimensional stability.
Unlike stainless steel, Kovar has a controlled coefficient of thermal expansion that closely matches glass and alumina ceramics, reducing stress during thermal cycling.
Kovar is widely used for hermetic sealing applications where thermal expansion compatibility with glass or ceramics is critical, such as electronic packages and photonic assemblies.
Yes. Compared to other ceramics, they are much more machinable and can often be shaped without diamond tooling.
They’re used for insulation parts, low-temperature structural components, and cost-effective prototypes.
Yes. Its hardness requires diamond grinding and specialized CNC methods to prevent cracking and achieve precision.
It is commonly used for high-stress, high-speed, and high-temperature components, especially in aerospace and mechanical systems.
Yes, due to its toughness and density, but with diamond tools and advanced CNC methods, we achieve high-quality results.
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