CNC Machining in Kovar

Kovar is a controlled-expansion alloy engineered to match the thermal expansion of glass and ceramics. InstaVoxel offers precision CNC machining for Kovar components used in hermetic sealing, electronics, photonics, and aerospace applications.

Advantages of Kovar

Kovar’s unique thermal expansion behavior allows reliable glass-to-metal and ceramic-to-metal seals, making it essential for vacuum-tight and thermally stable assemblies.

Key Features

Controlled thermal expansion compatible with glass and ceramics

Excellent hermetic sealing performance

Stable mechanical properties under thermal cycling

Good weldability and plating compatibility

Available Kovar Specifications

The following table shows common Kovar. If you have any other alloy requirements, please contact us.

Kovar

Tensile Strength

Elongation at Break

Hardness

Density

51,000 PSI

27%

Rockwell B88

0.302 lb/in³
(8.36 g/cm³)

Kovar Surface Finishes

The following table shows common surface finishes for Kovar.

Bead Blast

Gold Plating

Silver Plating

Powder Coating

Polishing

Brushing

Kovar FAQs

What tolerances can be achieved with CNC-machined Kovar parts?

Typical CNC milling and turning tolerances of ±0.005 mm are achievable, with tighter control applied to sealing and mating surfaces.
Can Kovar be plated or welded after machining?

Yes. Kovar is commonly nickel- or gold-plated and has good weldability, making it suitable for hermetic and vacuum-sealed assemblies.
Is Kovar difficult to machine?

Kovar is machinable but prone to work hardening. Proper cutting parameters and stress-aware machining sequences are essential to maintain dimensional stability.
Why is Kovar preferred over stainless steel for sealing applications?

Unlike stainless steel, Kovar has a controlled coefficient of thermal expansion that closely matches glass and alumina ceramics, reducing stress during thermal cycling.
What is Kovar primarily used for?

Kovar is widely used for hermetic sealing applications where thermal expansion compatibility with glass or ceramics is critical, such as electronic packages and photonic assemblies.